| Property | Value |
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| rdfs:label | |
| rdfs:comment | - IPDIA activity is based on an innovative technology called PICS (Passive Integration Connecting Substrate). The PICS technology developed by IPDiA R&D team uses the thickness of the silicon to integrate tens to even hundreds of passive components. The figure on the right shows a sectional view of PICS capacitors: Benefits of PICS technology:
* Miniaturization
* Reliability
* Cost reduction IPDiA offers a wide product range: 3D silicon capacitors, integrated passive components on silicon, ESD protection devices for HB LEDs. Visit IPDiA website :
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| dbkwik:speedydeletion/property/wikiPageUsesTemplate | |
| abstract | - IPDIA activity is based on an innovative technology called PICS (Passive Integration Connecting Substrate). The PICS technology developed by IPDiA R&D team uses the thickness of the silicon to integrate tens to even hundreds of passive components. The figure on the right shows a sectional view of PICS capacitors: Benefits of PICS technology:
* Miniaturization
* Reliability
* Cost reduction IPDiA offers a wide product range: 3D silicon capacitors, integrated passive components on silicon, ESD protection devices for HB LEDs. Visit IPDiA website :
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